GAEA 750 Automatic Dispensing System
High-speed inline dispensing
Applications: CSP/BGA underfill/component encapsulation, precision coating/silver paste/red
glue/semiconductor chip packaging/solder paste and so on
Linear motor
High-speed production
Stable and reliable
Top/bottom vision systems
Customizable selection of various light sources
Modular dispensing mechanism
Maximize production flexibility
Reduces manufacturing investment cost
Ultra-high pixel industrial camera
Mark positioning/barcode scanning/glue inspection
Automatic compensation for dispensing and other functions
Track with automatic width adjustment Segmented track design/reduces board loading and unloading time
GAEA 750 Automatic Dispensing System
Dispensing system for electronic packaging in 3C and Pan semiconductor fields mainly applied to:
1.Under-fill
2. Dam and Fill|
3. Precision Coating
4. Silver Paste, Hot Melt Adhesive
5. Package on Package
6. Solder Paste
Integrated with functions such as dispensing and automatic heating, it features high precision superior quality and high reliability
