GAEA 700 Automatic Dispensing System
High-speed inline dispensing Applications: CSP/BGA underfill/component encapsulation, precision coating/silver paste/red glue/ semiconductor chip packaging/solder paste and so on
Linear motor
High-speed production
Stable & reliable
Top/bottom vision systems
Customizable selection of various light sources
Modular dispensing mechanism
Maximize production flexibility
Reduces manufacturing investment cost
Ultra-high pixel industrial camera
Mark positioning/barcode scanning/glue inspection
Automatic compensation for dispensing and other functions
Track with automatic width adjustment
Segmented track design/reduces board loading and unloading time