MINI LED Die Bonder
Applies to LED bonding for backlight modules and display panels Adopts automatic inline design, supports automatic LED reels changeover, and features high -precision high-efficiency and high reliability
30 pcs/s, CPH 180,000 @ 1 mm pitch
High-efficiency placement efficiency: 30 pcs/s, CPH 180,000 @ 1 mm pitch
High-precision placement: ± 20 μm @ 3σ
Multi-damping structure with intelligent design
Scalable design supporting multi-unit inline operation
Automatic LED reel changeover
Storage capacity for up to 12 reels
Enables long-hour automatic operation
Multiple high-resolution industrial cameras
Micron-level measurement accuracy
Ensures accurate positioning
MINI LED Die Bonder
MINI LED Die Attach process – Suitable for LED bonding for backlight modules and display panels The equipment adopts automatic inline design and supports automatic LED tray replacement featuring high precision, high efficiency and high reliability
